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Test, Assembly & Packaging 

 
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Thermal Shock TestingHermetic Seal TestingVapor Phase Soldering FluidsChip Testing

Thermal shock testing is performed to check the resistance of electronic devices to extreme changes in temperature. The test is carried out by alternately dipping the devices in liquids maintained at two different temperatures.

For military applications thermal shock test is performed as specified in MIL STD 883 method 1011 or MIL STD 202 method 107.

Traditionally two different fluids can be used in the hot and cold bath, but this practice presents several disadvantages.

Galden® PFPE fluids can operate at very low as well as elevated temperatures, and their Single Fluid System is an advantageous alternative to the Dual Fluid Solution.

A single fluid for both baths allows for a dramatic decrease in operating costs by decreasing fluid consumption, reducing equipment downtime, eliminating cross contamination and reducing inventory to a single product.

Galden® PFPE D02TS and D03 are the single fluids which can successfully replace a dual fluid system.

Galden® PFPE D02TS is proposed for all military applications; it meets MIL STD 883 and MIL STD 202 while for all non-military applications Galden® PFPE D03 may be suitable.

Thermal Shock Testing

Galden® PFPE Fluids for Thermal Shock Testing Conforming to MIL STD 883

Test Condition Hot Step
[°C]
Cold Step
[°C]
Hot Bath
Fluid
Cold Bath
Fluid
B +125 -55 D02
D02TS
DET
D02TS
C +150 -65 D02
D02TS
DET
D02TS
D +200 -65 D05 DET
E +150 -195 D02
D02TS
Liquid N2
F +200 -195 D05 Liquid N2

 

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Last Update (10/12/2013)