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Specialty Polymers for E/E Production Equipment 

 
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Vapor Phase Soldering FluidsThermal Shock TestingHermetic Seal TestingVacuum Pump LubricationMagnetic Recording Media Lubrication

When the chips are packaged and tested, they must be assembled on mother boards. Vapor Phase Soldering (VPS) uses the latent heat of condensation of Galden® PFPE vapors in order to melt solder paste and hence to obtain reliable metal joints. Solder traditionally used ~ 60% of tin (Sn) and ~ 40% of lead (Pb).

Now alternative solder materials have been introduced; the most common replacements for lead are silver (Ag), Copper (Cu) and Bismuth (Bi). These alternative materials, however, bring a challenge: higher melting temperature. Traditional tin/lead solders melt at ~ 180°C while lead free solder melts at ~227°C. Soldering temperatures are, as well as heating issues, ongoing concerns for PCBs assemblers.

Galden® PFPE LS / HS is a line of fully fluorinated fluids specifically designed for the VPS process with the following properties:

  • The narrow molecular weight distribution
  • Very strong carbon-fluorine bond
  • Flexible ether link

Galden® PFPE LS and HS fluids precise vapor temperature eliminates overheating, offering the widest temperature range to lead free solders up to 260°C and are RoHS compliant.

 

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Last Update (4/11/2013)